ASML Unveils Cutting-Edge High-NA EUV Lithography Machine
Revolutionizing Semiconductor Manufacturing
Pushing the Boundaries of Chip Technology
VELDHOVEN, Netherlands (Reuters) - Chip toolmaking giant ASML (ASMLAS) announced today that it is ramping up production of its new 350 million High-NA (numerical aperture) EUV (extreme ultraviolet) machine, a groundbreaking device poised to reshape the semiconductor industry.
The High-NA EUV machine plays a crucial role in the miniaturization of transistors, enabling the production of even more powerful and efficient chips. ASML has been at the forefront of this technology, continuously advancing its DUV (deep ultraviolet) and 0.33 NA EUV scanners.
As part of its unwavering commitment to innovation, ASML shipped its first High-NA EUV lithography tool to Intel this week. The unit, shipped from Veldhoven in the Netherlands, marks a significant milestone in the industry's pursuit of cutting-edge chipmaking technology.
Beyond post-3nm nodes, ASML and its partners are developing the brand-new EUV tool, the Twinscan EXE5000 series, featuring a 0.55 NA High-NA lens capable of 8nm resolution. This advanced tool will further drive the miniaturization of transistors, pushing the boundaries of chip design.
With its relentless drive for innovation, ASML continues to dominate the chipmaking landscape. The High-NA EUV machine is a testament to the company's unwavering commitment to pushing the boundaries of semiconductor manufacturing and shaping the future of technology.
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